Dr. KE Pingchuan, PatrickPatrickDr. KE PingchuanLin, GuiyeGuiyeLinZhou, JingkunJingkunZhouProf. CHAN Ching, SelinaSelinaProf. CHAN Ching2025-11-202025-11-202025Ke, P., Lin, G., Zhou, J., & Chan, S. C. (2025). Augmented reality system with flexible electronic skin for intangible cultural heritage preservation: A case study of Hong Kong Yu Lan Festival. In Shim, H., Choi, S., Lee, W., Rii, H., & Kim, S. (Eds.). The international archives of the photogrammetry, remote sensing and spatial information sciences, volume XLVIII-M-9-2025. 30th CIPA Symposium “Heritage Conservation from Bits: From Digital Documentation to Data-driven Heritage Conservation”, Seoul, Republic of Korea (pp. 667-672). The International Society for Photogrammetry and Remote Sensing.http://hdl.handle.net/20.500.11861/26099Open access<jats:p>Abstract. This study presents an innovative multisensory augmented reality (AR) system integrated with flexible electronic skin technology to address the challenges of preserving intangible cultural heritage (ICH), focusing on the Hong Kong Yu Lan Festival. The system combines AR’s contextual reconstruction capabilities with customizable haptic feedback to recreate immersive cultural experiences. By simulating tactile sensations such as ritual implement vibrations and incense temperature variations, the technology bridges the gap between traditional practices and modern digital preservation methods. The modular design of the electronic skin allows for adaptable wearability, while AR enhances visual and auditory immersion. This research contributes a scalable framework for ICH preservation, with potential applications in other tactile-dependent cultural practices worldwide. </jats:p>enIntangible Cultural Heritage PreservationAugmented RealityFlexible Electronic SkinHaptic FeedbackMultisensory InteractionHong Kong Yu Lan FestivalAugmented reality system with flexible electronic skin for intangible cultural heritage preservation: A case study of Hong Kong Yu Lan FestivalConference Paper10.5194/isprs-archives-XLVIII-M-9-2025-667-2025